CuClad 233 2-Layer 20mil PCB – High-Frequency RF Board with Immersion Gold Finish

1.Introduction of CuClad 233

Rogers CuClad 233 laminates are cross-piled, woven fiberglass and PTFE composite materials offering a low dielectric constant value of 2.33. These laminates utilize a medium fiberglass/PTFE ratio to balance low dielectric constant (Dk) and improved dissipation factor without compromising mechanical properties. The cross-piled construction ensures greater dimensional stability along with balanced electrical and mechanical performance.

2.Key Features

Dielectric Constant (Dk) of 2.33 at 10GHz / 1MHz
Dissipation Factor of 0.0013 at 10GHz
Low Moisture Absorption of 0.02%
Strong Peel Strength of 14 lbs/in
Low Outgassing: TML 0.01%, CVCM 0.01%, WVR 0%
Cross-Plied Woven Fiberglass with 90° alternating plies
High PTFE to Glass Ratio
Superior dielectric constant uniformity compared to non-woven reinforced laminates

3.Benefits

Stable Dk over a wide frequency range
Supports wider line widths for reduced insertion loss
Low circuit losses at high frequencies
Suitable for large PCBs and antenna formats
CTE in-plane matches aluminum for aerospace applications

4.PCB Construction Details

5.PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
Rogers CuClad 233 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm

6.PCB Statistics:

Components: 35
Total Pads: 127
Thru Hole Pads: 73
Top SMT Pads: 54
Bottom SMT Pads: 0
Vias: 99
Nets: 2

7.Typical Applications

Radars, Electronic Countermeasures, Electronic Support Measures
Microwave Components (LNAs, filters, couplers, etc.)

8.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support